由 Jeff Zopff | 8 月 30, 2013 | APL News, Press Release @zh-hans
Presentation to examine process optimization for wide IO Package-on-Package implementation August 30, 2013 – On September 5, 14:00 – 14:30, Universal Instruments’ Advanced Process Lab (APL) will present Assembly Solutions for Wide IO Package-on-Package...
由 Jeff Zopff | 8 月 28, 2013 | Press Release @zh-hans
Industry expert David McCann, vice president, Packaging and R&D, GLOBALFOUNDRIES, will present keynote address at technology-sharing event. August 28, 2013 – On September 24–26, Universal Instruments’ Advanced Process Lab (APL) will hold a reunion of former...
由 Jeff Zopff | 8 月 14, 2013 | Press Release @zh-hans
Leading contract manufacturer in South Africa triples output using Universal Instruments’ surface mount and odd-form solutions. August 14, 2013 – Microtronix Manufacturing recently added two Universal Advantis® AC-90T Platforms, one Genesis GX-11S Platform with...
由 Jeff Zopff | 7 月 17, 2013 | Press Release @zh-hans
Ongoing collaboration among industry experts continues to provide competitive advantage through leading-edge knowledge of new and emerging technologies and processes. July 17, 2013 – In June, Universal Instruments’ Advanced Process Lab (APL) held its second...
由 Jeff Zopff | 7 月 16, 2013 | Press Release @zh-hans
Changes boost Universal’s ability to deliver outstanding products and service in Southeast Asia. July 16, 2013 – Building on last year’s appointment of Mark Norris as general manager of Southeast Asia Customer Operations, Universal Instruments continues its...
