Process expertise complements mature and versatile technologies to address diverse packaging and assembly requirements
October 20, 2014 – Universal Instruments will be exhibiting on Table #8 at the 2014 MEPTEC Semiconductor Packaging Technology Symposium in Santa Clara, CA on October 23. The company will feature its uniquely comprehensive solutions for the challenging and dynamic demands of the advanced semiconductor packaging market.
Leveraging its legacy as a pioneer of leading-edge placement platforms, Universal has developed the capabilities of its GenesisSC™ Platform to conquer next-generation packaging and assembly requirements. GenesisSC offers a complete solution to flip chip applications by combining semiconductor accuracy with the speed and robustness of Universal’s surface mount platform lineup.
“The demand for increasing performance in smaller form factors is driving finer pitches, smaller bumps, higher densities, and stacked packaging. These high-precision applications require specialized capabilities, and can increase manufacturing costs and severely impact yields if the right solution is not in place,” said Glenn Farris, Universal’s Vice President of Marketing. “Our advanced packaging platform incorporates state-of-the-art handling, positioning, vision, and placement technologies to ensure the highest throughput at optimal accuracy. This affords our customers superior yields, product quality, cost-per-placement, and output per floor space,” he added.
Advanced packaging applications require not only specialized equipment, but also focused knowledge to effectively manage new processes and materials. Universal’s Advanced Process Lab (APL) has long-standing partnerships with industry leaders and years of experience in designing, implementing, and optimizing these applications.
“As the industry continues to evolve, collaborations amongst industry peers like those here at MEPTEC will ultimately define the future of electronics,” commented Farris. “The market demand will progressively drive the need for innovative thinking as well as exciting new equipment and processes to support those innovations. Universal is proud to be at the forefront of these innovations, enabling our customers to successfully embrace leading-edge technology challenges.”
To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.