由 Jeff Zopff | 5 月 1, 2014 | Press Release @zh-hans
Versatile platform portfolio extends capabilities to deliver cost-effective performance for a full range of application challenges April 25, 2014 – Universal Instruments will display its Fuzion® Platform at the SMT Hybrid Packaging trade show May 6–8 at the...
由 Jeff Zopff | 4 月 25, 2014 | Press Release @zh-hans
Martin Anselm, Ph.D., Manager, Universal Instruments’ APL AREA Consortium, will examine the accelerated integration of new materials and components, and the challenges this poses for reliability testing April 25, 2014 – Universal Instruments’ Advanced Process...
由 Jeff Zopff | 4 月 18, 2014 | Press Release @zh-hans
凭着性价比高及性能超卓的异型组装方案，环球仪器将后端组装挑战转为策略优势。 中国上海，2014年4月18日 – 环球仪器将在4月23至25日，于上海世博展览馆举行的NEPCON中国2014展中，向厂家展示其出色的自动化异型贴装平台方案，包括刚推出的FuzionOF™平台，与及最新的Radial 88HT 3.5毫米径向元件插件机，欢迎业内人士莅临环球仪器经销商吉创国际有限公司的展位（展位号：B-1F12）进行交流。...
由 Jeff Zopff | 4 月 9, 2014 | Press Release @zh-hans
For the second consecutive year, US-based contract manufacturer Silicon Mountain has closed a deal for a Universal Instruments Fuzion® Platform solution at the IPC APEX EXPO. April 9, 2014 – Universal Instruments again enjoyed a very successful IPC APEX EXPO,...
由 Jeff Zopff | 3 月 21, 2014 | Press Release @zh-hans
Industry’s broadest range of fully integrated technologies and exclusive expertise enable powerful, flexible solutions for all electronics manufacturing environments. March 21, 2014 – Universal Instruments will display its comprehensive portfolio of solutions building...
