美洲
电子产品在许多方面改善了人们的生活，农业也不例外。通过利用传感器、机器视觉、机器人、网络甚至人工智能等技术的推动，使动植物农业生产都得到了提高。这些进步使农业环境能够收集、处理相关信息并作出反应，提供卓越的植物栽培和收获能力，提供更新鲜的食物等等。
通过提供一流的设备和实施稳健的、可重复的流程，环球仪器已经帮助许多客户在智能电子装置方面迈出了下一步。在农业领域，传感器和 LED（发光二极管）照明发挥着至关重要的作用，环球仪器已经成功与一些公司合作，在各种市场上生产这些产品。我们的平台可以支持传感器非常苛刻的先进封装要求，包括小尺寸基板和柔性应用，同时还能处理 LED（发光二极管）照明的大尺寸电路板。这些能力是我们真正的竞争优势，推动农业业务朝向智能发展。
照明
- 顶置 LED（发光二极管）生长灯
监测设备
- RFID（射频识别）标签
智能设备
- 物联网连接设备（温室控制等）
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农业市场应用
Server/Network
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
⬤
DIMM memory module automation
⬤
Large PCB server board SMT assembly
⬤
SSD e-cap form/cut & insert
⬤
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Mobility & Wearables
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Automotive
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
⬤
LIDAR & MEMs module assembly
⬤
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Medical
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
⬤
ITAR Compliant facility
Mil/Aero
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
⬤
Industrial/IOT
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Smart Agriculture
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Renewable Energy
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤