可穿戴设备
智能相机、智能眼镜、智能服装、游戏娱乐等可穿戴技术的引入，正在迅速打开一个技术和连接的新世界。事实上，可穿戴设备已经进入了主流，它们将改善我们的健康，让生活更舒适、更轻松。对于制造商来说，困难在于如何实施高效的批量生产流程来满足不断增长的市场需求。
环球设备与许多技术领先者合作，帮助开发或完善他们的可穿戴设备产品，其中许多产品当时还不是主流。从小批量生产到大批量需求，我们帮助制造商将可靠的可穿戴设备推向市场。环球设备拥有丰富的项目经验以及独特的工具组合，我们是您可穿戴设备项目的合适合作伙伴。我们将开发成功的解决方案，为您提供所需的产能，同时帮助实现实时交付实时数据。
智能手表
- 身体监测
- 太阳能发电
智能珠宝
- 智能戒指
- 智能手镯/手链
- 智能项链
- 智能耳环
健身追踪器
- 佩戴在手腕上
- 佩戴在手臂上
- 佩戴在手指上
智能服装
- 智能衬衣
- 智能裤子
- 智能鞋子
- 智能袜子
植入设备
- 智能药丸
- 心脏起搏器
头戴式显示器
- 智能眼镜
- 虚拟现实 (VR) 头戴式装置
想要打造更好的解决方案？
隐藏式切换
您的内容放在这里。在行内或在模块内容设置中编辑或删除此文本。您还可以在模块“设计”设置中对这些内容的各个方面进行样式设计，甚至可以在模块“高级”设置中对这些文字应用自定义 CSS（层叠样式表）。
可穿戴设备市场应用
资源
Server/Network
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
⬤
DIMM memory module automation
⬤
Large PCB server board SMT assembly
⬤
SSD e-cap form/cut & insert
⬤
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Mobility & Wearables
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Automotive
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
⬤
LIDAR & MEMs module assembly
⬤
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Medical
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
⬤
ITAR Compliant facility
Mil/Aero
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
⬤
Industrial/IOT
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Smart Agriculture
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Renewable Energy
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤