军用和航空
军用、航空航天和商用航空产品受到严格监管，面临材料限制、甚至网络安全等新障碍。遵守这些准则是强制性的，每个产品面临的相关挑战各不相同。然而，这些产品的制造商必须保持高产量，同时有效地从一种产品过渡到另一种产品，以保持竞争优势。
环球仪器与市场中的许多行业领导者合作，携手打造世界更先进的产品。一路走来，我们的先进工艺实验室帮助我们建立了符合 ITAR（《国际武器贸易条例》）的工艺和应用，来支持严格的协议。我们的设备组合满足了在市场上制造产品的全部技术要求，所有产品都具有卓越的良率和更佳的精度。我们平台固有的灵活性，促进了一款优秀产品到下一款产品的改进。这使我们的客户有能力和信心快速提供关键产品。
武器系统
- 航空武器
- 步兵武器
- 海军武器
制导系统
- 监控跟踪设备
- 无人机
- 自动驾驶汽车
- 报警器
通信
- 战术加密（安全）语音/数据
控制/仪表
- 监视系统
- 飞行仪表
运输
- 公路运输
- 铁路运输
- 海上运输
- 航空运输
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军用和航空市场应用
资源
Server/Network
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
⬤
DIMM memory module automation
⬤
Large PCB server board SMT assembly
⬤
SSD e-cap form/cut & insert
⬤
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Mobility & Wearables
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Automotive
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
⬤
LIDAR & MEMs module assembly
⬤
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Medical
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
⬤
ITAR Compliant facility
Mil/Aero
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
⬤
Industrial/IOT
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Smart Agriculture
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Renewable Energy
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤