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活动

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SMTA International 2016
SMTA International 2016

Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.

SMT Hybrid Packaging 2016
SMT Hybrid Packaging 2016

Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.

NEPCON China 2016
NEPCON China 2016

Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.

APEX 2016
APEX 2016

Visit Universal on Booth 2441 at the 2016 IPC APEX EXPO 2016 on March 15–17 and see two pioneering additions to the industry’s most comprehensive solutions portfolio: the Uflex™ modular automation platform and the Flexbond™ hot bar bonding platform.

SEMICON China 2016
SEMICON China 2016

Visit Universal on Channel Partner Sigmatek’s Booth# 1531 at SEMICON Shanghai 2016 on March 15–17 and learn how Universal’s team of solutions experts can help solve your manufacturing challenges.

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