近期活动

  • SMT_Nurem_logo_2017

    SMT Hybrid Packaging 2017

    Visit Universal on Hall 4-101 on May 16–18 and let our solutions experts help you optimize productivity for your greatest packaging and production challenges.

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    IPC APEX EXPO 2017

    Visit Universal on Booth #827 on February 14–16 to see our latest technology innovations and discuss your specific production challenges with our solutions experts.

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    SMTA International 2016

    Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.

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    SMT Hybrid Packaging 2016

    Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.

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    NEPCON China 2016

    Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.